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↺42h Intel86% beat 🟢

↺66h Everspin Techno…-54% miss 🔴

5¼d Microchip Techn…

95h Globalfoundries

78h Skyworks Soluti…

4¼d Wolfspeed,

54h ON Semiconducto…

4¼d Coherent

↺4¾d Amkor Technolog…-3.8% miss 🔴

5¼d Lumentum

 Semi. Fabs and Clean Rooms
3¼h ago: Activity is accelerating in the U.S., India, and South Korea with fab buildouts and cleanroom expansions, but yield/process execution, advanced packaging capacity like CoWoS, and memory supply remain critical constraints amid AI demand. Samsung notes utilization >100% for advanced nodes; TSMC expanding packaging; India seeing first commercial lines; Intel improving 18A yields.

 Tokyo Electron’s Outlook Beats on Surging AI Chip Spending  - Tokyo Electron Ltd. gave a better-than-expected annual outlook in a reflection of accelerated spending by chipmakers to meet AI hardware demand.

 Global Cloud Market Reaches $167.7 Billion in Q3 as Growth Hits 55%  - The global cloud market reached $167.7 billion in Q3 2026, growing 55% year over year as AI demand and neocloud providers reshape the market. See this quarter's trends.

 Smarter Coolant Distribution Units for Liquid-Cooled AI Data Centers  - Simplify liquid-cooled AI data center design with NXP NAFE analog front ends for precise sensing and control.

 Google: Agentic AI Will Drive New Demands on Data Center CPUs  - Agents present a bursty workload, leaving CPUs frequently idle, which is placing new demands on CPU infrastructure. The post Google: Agentic AI Will Drive New Demands on Data Center CPUs appeared first on EE Times .

 Bloomberg Businessweek Daily: Amazon Chip Earnings  - The people, companies and trends shaping the global economy. Watch Carol and Tim LIVE every day on YouTube: http://bit.ly/3vTiACFAmazon reported higher capital spending than expected, while its e-commerce revenue slowed ahead of a potentially lukewarm holiday sales season. Intel’s revenue forecast missed...

 How AI is Reshaping Semiconductor Design and Manufacturing  - While AI is transforming nearly every industry, some of its most significant advances are happening inside the semiconductor factories building the chips that power it. If you design AI systems, those manufacturing advances directly influence your performance, efficiency, and path to market.

 First Solar licensing CubicPV’s US patents for perovskite solar technology  - Agreement expands First Solar’s freedom to operate as it progresses perovskite device development

 Tech rout reaches sensors, but not evenly across physical AI  - Sensors-heavy ST and Infineon dropped about 6%, after Intel’s 29% decline on lower revenue guidance and PC declines

 AI, fuelled by advanced chips, set to power semiconductor manufacturing: industry veteran  - Not only is AI driving up demand for semiconductors, it is also becoming integrated into their manufacture, corporate leaders say

 Nasdaq Drops 2.26% as Tech Earnings Weigh  - Selling pressure also spread to major semiconductor stocks such as NVIDIA and AMD.

 Can eBooks survive?  - in 1998 the eBook was emerging to meet with considerable scepticism. In October 1998 EW carried this account of the debate. ‘At a recent eBook conference in the US, […] The post Can eBooks survive? appeared first on Electronics Weekly .

 Korea's semiconductor windfall is becoming a concern (KOR)  - Korea's semiconductor windfall is becoming a concern (KOR) An AI-driven chip boom is masking stalled reforms, weak job quality and growing vulnerability to Chinese competition. 10/29/2026 - 08:38 PM Opinion Desk

 [News] MediaTek Confirms Second AI ASIC Customer for 2028 Production; First ASIC Shipments Begin in Sept.  - MediaTek reported double-digit revenue and profit growth in the third quarter of 2026. According to the company's earnings release, consolidated revenue reached NT$168.06 billion, up 10.4% QoQ and 18.3% YoY, while gross margin remained stable at 46.3%. Net income rose 14.6% QoQ and 10.8% YoY to NT$2......

 AI 算力暴增百倍推升驗證難度,台積電袁立本提七大行動讓台灣全球 AI 樞紐  - 台積電 業務開發副總經理袁立本指出,全球 AI 產業已從實驗室階段的「創新週期」,全面邁入大規模部署的「產業化規模週期」。隨著 AI 伺服器算力百倍成長,產品開發與量產時程急遽縮短,晶片與系統驗證難度呈指數型攀升。袁立本強調,台灣具備全球最完整的...

 Farm PC 'maintained' by a 14-year-old dumped support chap in a steaming pile of tech mess  - Human users can be hard to handle. A few hundred head of cattle and unsupported windows XP can really stink things up

 The Latest News In IC Packaging  - TSMC buys plant; Marvell-Lumentum merger?; Tenstorrent; chiplets; design/manufacturing services; panel-level packaging

 Samsung's record $80.4B Q3 profit fails to impress investors  - Samsung's record $80.4B Q3 profit fails to impress investors The chip division, responsible for almost all of the earnings, missed forecasts to weigh on the tech giant's stock. 10/29/2026 - 05:36 AM LEE JAE-LIM

 The Future of Electromagnetic Shields Could Be Lighter, Stronger, and Greener  - Researchers are exploring a new generation of electromagnetic shielding materials that combine exceptional conductivity with improved strength and flexibility. Electromagnetic shielding materials must block unwanted signals without adding excessive weight or sacrificing durability. Conventional options,...

 Titanium boosts thermoelectric performance of thin films by 250-fold  - Every electronic device, factory and vehicle generates heat that often goes to waste. What if that energy could be recovered to generate electricity using thin films manufactured without high-temperature processing? Researchers ...

 First Solar inaugurates first phase of South Carolina production facility  - Staffing of 500 to rise to nearly 700 by mid-2027 when second phase completed

 AI Inference Drives CPU and DDR5 Demand, with High-Capacitance MLCC Shortages Expected to Persist Through 1H27, Says TrendForce  - TrendForce's latest MLCC industry research shows that the rapid evolution of AI applications from model training to inference and AI agents is driving a new wave of CPU demand. Since each CPU requires accompanying power modules and DDR5 memory, the proliferation of these components is driving a substantial...

 🌑 🇹🇼🇰🇷🇨🇳 AsiaPac 
🇦🇺  ---  ☀️ +

↺4¼d SK Hynix-35% miss 🔴

↺86h Samsung Electro…-16% miss 🔴

↺85h United Microele…-5.8% miss 🔴

↺61h ASE Industrial11% beat 🟢

 Intel shifts production capacity from consumer to server CPUs in face of 'unprecedented' AI demand  - Intel is expanding chipmaking and advanced packaging capacity across the U.S., Ireland, and Malaysia to meet surging AI-driven demand for data center CPUs amid shrinking PC market and persistent supply constraints.

 Chip Industry Week In Review  - HBM shortages threaten AI expansion; TSMC weighs price hikes; advanced packaging ramps; domain-specialized AI models; Infineon and UMC boost fab investments; Intel's quantum move; Lam and imec advance 3D integration; Google expands TPUs; AI-driven earnings; CPU benchmarking methodology for agentic AI....

 Podcast EP376: Samtec’s Recent Pariticpaion in High-Profile Shows with Matt Burns  - Daniel is joined by Matthew Burns. Matt develops go-to-market strategies for Samtec’s Silicon-to-Silicon solutions. Over the course of 25 years, he has been a leader in design, applications engineering, industry standards, technical sales and marketing in the telecommunications, medical and electronic...

 From Reactive Power Monitoring to Predictive Infrastructure Visibility  - Multi-Channel Smart Metering Demonstration Application with our PIC32CXMTC series, a family of System-on-Chip (SoC) solutions built around dual 32-bit Arm® Cortex®-M4F RISC processors.

 GomSpace launches OBRIA NANO for Ukrainian satcoms  - Ukraine’s HIMERA – a defence startup – and Denmark’s GomSpace – which manufactures satellites – have announced the launch of OBRIA NANO. This is the first test satellite for an […] The post GomSpace launches OBRIA NANO for Ukrainian satcoms appeared first on Electronics Weekly .

 Seoul National University Graduate School Enrollment Drops Amid Semiconductor Boom  - According to the government and the Korea Semiconductor Industry Association, the number of personnel required in the domestic semiconductor industry is expected to increase from 177,000 people in 2021

 Vox Power EIRE600 offers 600 W and three cooling options  - The Vox Power EIRE600 is a 600 W single-output open-frame AC/DC power supply measuring 127 × 76.2 × 27.9 mm (5 ×…

 What a Marvell-Lumentum Deal Means for DSPs, Lasers, and Modules  - With insights from Cignal AI on vertical integration, kit pricing, and the risk to Marvell’s PAM4 DSP share

 10 Insights from the Semiconductor Supply Chain  - Dissecting the current earnings cycle.

 Why Shrinking Component Geometries Force a Rethink of BGA Rework Heating Methods  - As components shrink to 01005 scale and board densities rise, BGA rework requires more precise heat control. The post Why Shrinking Component Geometries Force a Rethink of BGA Rework Heating Methods appeared first on EE Times .

 Intel Q3 2026: Dead Inside  - Inexcusable Incompetence

 AI can design the chip, manufacturing it is harder  - Design lives primarily in a structured environment of models, rules, constraints, libraries, and solver outputs while manufacturing doesn’t. The post AI can design the chip, manufacturing it is harder appeared first on EDN .

 Nagare Labs Emerges from Stealth to Break AI’s Memory Bottleneck  - Atlanta based spinout raises $5M from Playground Global to build a new memory tier. The post Nagare Labs Emerges from Stealth to Break AI’s Memory Bottleneck appeared first on Semiconductor Digest .

 Spotlight on Bright Minds: From the NXP Cup to Real-World Embedded Software  - Meet Radka Ďuriačová, a Software Intern in the MCUXpresso Middleware Multimedia team in Brno, Czech Republic. Her journey with NXP started with the NXP Cup, where she discovered how much she enjoyed bringing hardware to life through software.

 Record-setting 2.75 gigahertz LED designed for fast, energy-efficient data centers  - A collaboration between the University of Illinois Urbana-Champaign's Grainger College of Engineering and the University of Notre Dame has broken the world record for optical switching speed in quantum well LEDs. The gallium ...

 Welcome Marie Kane, Ph.D. to Our Stakeholder Advisory Board  - FSI Stakeholder Advisory Board Update – October 2026 We are thrilled to welcome Marie Kane, Ph.D., to the Florida Semiconductor Institute Stakeholder Advisory Board. Dr. Kane brings more than 20 years of experience in research, technology and national security. She currently serves as Assistant Vice...

 ML-Based Power Models for CPUs. Innovation in Verification  - An effective learned power model for a CPU could be a significant advantage in early estimation of power performance against realistic workloads in complex architectures. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at...

 Cloud to edge AI: If and when, to what degree, and how and why  - AI inference remains cloud-mostly, albeit not for long. Whether it shifts to client devices in part or completely, who will the winners be? The post Cloud to edge AI: If and when, to what degree, and how and why appeared first on EDN .

 ST forecasts $4bn Q4  - ST reported Q3 revenues of $3.76 billion, gross margin of 37.3%, operating income of $367 million, and net income of $291 million and operating income of $429 million. Jean-Marc […] The post ST forecasts $4bn Q4 appeared first on Electronics Weekly .

 🌑 EMEA 
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↺54h STMicroelectron…-7.5% miss 🔴

↺89h NXP Semiconduct…

41h Tower Semicondu…

↺46h X Fab Silicon F…78% beat 🟢

 Microsoft links ConnectWise supply chain attack to AI agents  - Microsoft has attributed the ConnectWise supply chain attack to Storm-0940, a China-aligned hacking group that used autonomous AI agents to…

 WD Chief Product Officer to Explore the Economics of Scaling AI at Web Summit 2026  - style="display: -webkit-box; -webkit-line-clamp: 4; -webkit-box-orient: vertical; overflow: hidden; text-overflow: ellipsis; max-height: 5em;"At Web Summit 2026 in Lisbon, WD (NASDAQ: WDC) will highlight why economically scalable data infrastructure is essential to supporting AI's next phase of growth....

 STMicro Forecasts Growth As Chip Demand Recovery Continues  - STMicroelectronics NV forecast fourth-quarter revenue growth as a recovery in chip demand continues after a prolonged slump.

 Making data ready for AI  - Artificial Intelligence Making data ready for AI AI can give existing data new value. Keeping that data understandable, accessible and economically available helps ensure it is ready when new opportunities emerge.

 Discerning and coding: the exponential equation process  - Most physical processes in nature have exponential properties, even if the underlying data looks noisy or otherwise messy. The post Discerning and coding: the exponential equation process appeared first on EDN .

 Samsung chief set to visit Japan ahead of company's 57th anniversary  - Samsung chief set to visit Japan ahead of company's 57th anniversary Executive Chairman Lee Jae-yong is reportedly set to travel to Japan a day before the company's 57th anniversary of Samsung Electronics' founding, with the company not scheduled to mark the occasion with a ceremony. 10/30/2026 - 02:09...

 Changing Wafer Foundries: Costs, Timeline, Risks and Qualification Checklist  - Moving an existing ASIC or semiconductor product to another wafer fab can lower manufacturing cost, improve supply continuity and reduce geopolitical exposure. But a foundry transfer is rarely a simple matter of sending the same masks to a different factory. Here is how to assess technical feasibility,...

 BEAMA sets up power grid group  - BEAMA has launched a new group for UK companies delivering power grid infrastructure, including those working in civil engineering, construction, design, specification and wider services. The Electricity Networks Infrastructure (ENI) […] The post BEAMA sets up power grid group appeared first on Electronics...

 Lone-Pair Stereoactivity Overrides Mass Scaling of Thermal Expansion and Heat Conduction in Non-vander Waals Layered Bismuth Oxychalcogenides  - Heavier chalcogens are generally expected to soften isostructural semiconductor lattices, raising thermal expansion and lowering thermal conductivity. Layered bismuth oxychalcogenides, Bi2O2X (X = S, Se, Te), are mixed-anion crystals whose covalent slabs and ionic sheets are bound electrostatically rather...

 Sandisk Reports Fiscal First Quarter 2027 Financial Results  - "We have started fiscal year 2027 with another quarter of strong performance, with robust and growi...

 Intel guides an ugly 4Q26 on all prospectus despite a solid 3Q  - 存儲記憶體大漲價造成的 PC需求不振,外加以色列廠爆炸停工影響數據中心晶片生產,造成 Intel 四季度營收,毛利率及EPS都不如市場預期

 Korea's semiconductor windfall is becoming a concern  - Korea's semiconductor windfall is becoming a concern An AI-driven chip boom is masking stalled reforms, weak job quality and growing vulnerability to Chinese competition. 10/29/2026 - 11:01 AM Opinion Desk

 Intel Reports Profit, Foundry Unit Narrows Losses  - Intel posted mixed financial results for the third quarter of 2026

 CXL Memory Pooling: Why Samsung & SK hynix Are Racing  - CXL memory pooling has hit production. Here’s why Samsung and SK hynix’s OCP 2026 moves on agentic AI’s KV cache matter more than raw memory capacity.

 Fable: The Thing That Was Too Good For Its Own Good  - 27 years ago a university student looked for a way round having to buy CDs to get single tracks. He coded a programme letting students share tracks stored on their […] The post Fable: The Thing That Was Too Good For Its Own Good appeared first on Electronics Weekly .

 The great DRAM divide: different paths to denser memory  - The world’s leading DRAM manufacturers are taking different approaches to the next generation of memory technology.

 NVision Reports Quantum Manufacturing Milestone, Strikes Partnership with HyperLight for Prototype Chips  - NVision, a quantum technology company, has published a landmark paper in Nature detailing the first individually addressable organic molecular spin-photon interface, key to connecting stationary qubits with photons. The company also revealed a...

 How AI Redefines Semiconductor Manufacturing, From Materials Up  - AI chip advances depend on more than design, requiring new materials, manufacturing equipment, and packaging technologies to meet rising performance demands. The post How AI Redefines Semiconductor Manufacturing, From Materials Up appeared first on EE Times .

 Silicon Valley’s Next Big Bet: Why YC Is Looking Beyond AI Models  - Original Article By SemiVision Research [Reading time: 5 mins]