Semi. Fabs and Clean Rooms 18m ago: Cleanroom construction and availability have emerged as the key constraint on semiconductor capacity growth through 2028-2030, outpacing tool or wafer supply issues. Intel is installing tools at Fab 62 in Arizona and raising the first truss at Ohio One, while Samsung's new Texas fab output is already fully reserved by AMD and Nvidia for 2nm HBM base dies years ahead of production. HBM production is consuming 3x the wafer capacity of standard DRAM, exacerbating shortages in specialty memory.
RAMageddon pushes Raspberry Pi pricing higher - Some people call it RAMageddon, which may be a bit extreme, but there's no doubting the tech backwash in terms of memory supply. As well as drinking the water, the AI hyperscalers are distorting the market for consumer memory... The post RAMageddon pushes Raspberry Pi pricing higher appeared first on...
Four Dutch-Taiwanese projects target scalable photonics - Four projects have been selected under the NetherlandsâTaiwan Techbridge Call to develop photonic technologies for wireless communications, optical interconnects and quantum computing.
Why Testing Automated Driving Is Harder Than It Looks - Instead of waiting for rare situations to occur on public roads, engineers can create those situations virtually. The post Why Testing Automated Driving Is Harder Than It Looks appeared first on Semiconductor Engineering .
Photonic and Electronic Interaction of TMD-Hybridized ZnO Nanowire Lasers - Semiconductor nanowire lasers are promising on-chip coherent light sources for photonic integrated circuits, but integration inevitably places them in contact with other materials, thereby changing their properties upon hybridization. In this study, we examine the photonic and electronic coupling between...
Australia’s Surplus Heads for Decade-Low on Chip, Energy Imports - Australia’s trade surplus is on track to slump to its lowest level in a decade this year, as chips and servers needed for data centers add to a surge in imports from China while energy costs spiral higher.
Electrification Week: From Energy to Motion - Explore the technologies shaping intelligent, efficient and integrated electrified systems during Electrification Week, November 16 through 20.
Korea posts record current account surplus - Korea posts record current account surplus The services deficit widened in September as travel spending and intellectual property payments increased, despite strong goods and investment income balances. 11/4/2026 - 07:03 PM
The next scientific breakthrough - Artificial Intelligence The next scientific breakthrough AI and HPC are helping scientists find new value in existing data.
NIST Sets a Clearer Course for the Post-Quantum Security Transition - NIST’s report, Transition to Post-Quantum Cryptography Standards , gives government agencies and technology suppliers a clearer framework for replacing cryptography vulnerable to future quantum computers. Its significance extends beyond selecting algorithms: it connects security priorities, application...
821 Trillion Won Budget Risks Debt Bomb - While tax revenue growth is expected due to improved semiconductor markets and corporate performance, the global economic environment can change at any time.
Is There Room for Small-Scale OSATs in India’s Chip Packaging Boom? - Small OSATs in India can start with ₹1.5–₹2 billion (~$15.8–$21 million), consultant Nitin Dodia said. But anchor customers, skilled staff, and qualification determine who survives. The post Is There Room for Small-Scale OSATs in India’s Chip Packaging Boom? appeared first on EE Times .
Coherix Names CEO: People in the News: 11/4/26 - The IEEE Photonics Society elected Marek Osinski, Ivana Gasulla, Malin Premaratne, and Dora Hu Juanjuan to its board of governors. Osinski is a distinguished professor of electrical and computer engineering at the University of New Mexico and Director of an NSF-supported National Quantum Virtual Laboratory...
HMGCC Challenge seeks technology to identify hostile RF emitters - The HMGCC (His Majesty’s Government Communications Centre) is launching a challenge – via the Satellite Applications Catapult – to create technology that can identify hostile RF emitters in battlefield situations. […] The post HMGCC Challenge seeks technology to identify hostile RF emitters appeared...
Bezier-GP: Bezier-Surface-Based Gaussian Process for Chips-on-Wafer Warpage Modeling - As the semiconductor industry transitions to the post-Moore paradigm, wafer warpage has become a critical quality issue in advanced packaging; particularly for 3D stacking and high-bandwidth memory manufacturing where die-level deformation can affect bonding quality, interconnect reliability, and yield....
How Allegro MicroSystems Increased OEE by Several Percentage Points with yieldHUB Live - Allegro MicroSystems’ experience with yieldHUB Live shows how better use of production data can translate into measurable manufacturing gains. At its high-volume semiconductor operation in the Philippines, Allegro set out to improve overall equipment effectiveness, or OEE, by one percentage point. According...
[News] DeepSeek V5 Could Complete Training on Huawei Ascend 950 in 2027, Moving Beyond Inference - As Huawei accelerates its Ascend AI chip roadmap, with the Ascend 960DT reportedly slated for early 2027, another milestone may be taking shape. According to Caiwen News, citing industry sources, DeepSeek plans to train its next-generation V5 model primarily on Huawei’s Ascend 950 chips, with the ......
3D-Printed Color Router Improves Image Quality in Low-Light Conditions - Most digital photography devices are equipped with color filters that separate light into three spectral passbands — red (R), green (G), and blue (B) — before light reaches the sensor. The most widely adopted configuration for filtering...
EU launches €525 million chip design platform to boost startups - Nov-5-2026 — The European Commission has launched the European Chip Design Platform (EuroCDP), backed by €525 million in investment to support a new generation of European semiconductor design companies. The initiative, launched by Henna Virkkunen, Executive Vice-President for Tech Sovereignty,...
RS announces strong half-year results - RS Group has announced strong results for H1 2026 with outperformance in all regions. “We have had a good start to 2026/27,” says RS CEO Simon Pryce. “Manufacturing sentiment remained […] The post RS announces strong half-year results appeared first on Electronics Weekly .
How to Implement "Trust in AI" in Enterprise Environments - What does it take to move AI from proof of concept to trusted use in business? Explore AI trust, data, governance, quality, human oversight, and organizational change through Fujitsu’s implementation experience.
Murata shrinks RF test connector footprint - Murata’s SWL MM8330-2600 is one of the industry’s smallest RF/microwave coaxial connectors with an integrated mechanical switch. The post Murata shrinks RF test connector footprint appeared first on EDN .
Democratic sweep clouds Korea-U.S. trade deals, boosts clean energy shares - Democratic sweep clouds Korea-U.S. trade deals, boosts clean energy shares A Democratic Congress could intensify scrutiny of Korean investments and nuclear cooperation while lifting hopes for solar and battery companies. 11/4/2026 - 05:12 AM SARAH CHEA, PARK EUN-JEE, KIM MIN-YOUNG
SPIE Names 2027 Prism Award Finalists - SPIE, the international society for optics and photonics, has named its finalists for the 2027 Prism Awards. The 21 products — from plucky startups to industry giants — selected in seven categories, will be honored during a Feb. 3 gala evening at Photonics West in San Francisco. The annual event,...
Researchers uncover hidden cause of aging in perovskite solar cells - A research team at The Hong Kong Polytechnic University (PolyU) has found a previously overlooked cause of aging in perovskite solar cells exposed to light. The team has also developed a solution that effectively extends ...
Sustainability Currents: AI’s Physical Bottlenecks Beyond Chips - The AI boom has largely been framed as a race for chips and compute, but as the technology scales, some of its biggest constraints are becoming increasingly physical. On this week’s episode of the Sustainability Currents podcast, Stephen Byrd, global head of thematic and sustainability research at Morgan...
Accelerating Plug-And-Play Prototyping In Chiplet-Based Designs - Shared resources, a mix of tools running at different speeds, and multiple dies are adding new challenges for design teams. The post Accelerating Plug-And-Play Prototyping In Chiplet-Based Designs appeared first on Semiconductor Engineering .
Optical Ceiling on Polaron Mobility in Disordered Molecular Semiconductors : Lessons from Eumelanin - Polaron hopping in disordered molecular semiconductors such as eumelanin is set by energetic disorder σ σ and reorganization energy λ λ . We show that the reduced polaron absorption band encodes this transport problem. Its value at zero energy fixes the mean hop rate, which bounds the mobility in...
Bosch Establishes Dedicated Semiconductor Division to Strengthen Chip Business - Effective January 1, 2028, Bosch will transfer its semiconductor operations to a new division called Semiconductors. The business will continue to be assigned to the Mobility business sector. Bosch’s semiconductor operations are currently part of its Mobility Electronics division. The post Bosch Establishes...
“Hybrid bonding requires more than a highly accurate machine” - Even silicon starts behaving like rubber on a microscopic level. As hybrid bonding moves toward pitches of 1 micrometer and below, tiny deformations become a major obstacle. Research by Besi and Imec shows why mastering the process is just as important as building a highly accurate bonding machine.
Marvell Acquiring Lumentum for $115B - Marvell has entered into a definitive agreement to acquire Lumentum in an all-stock transaction with an implied enterprise value of $115 billion for Lumentum. Post-closing, Marvell stockholders will own approximately 67% off the combined company on...
Fast, Sub-Volt HZO Ferroelectric Capacitors For DRAM-Like Memory (SNU) - Seoul National University-led researchers published “Resolving the Kay–Dunn limit and the speed–endurance dilemma in ferroelectric Hf0.5Zr0.5O2 for DRAM-class sub-volt capacitors.” The first author, Geun Hyeong Park, Ph.D., summarizes the work here: “Fast, frequently rewritten memory requires...
Why reliability metrics must dictate advanced-node physical implementation flow - Dynamic voltage drops, electromigration, and timing are not three axes to be optimized in sequence; they are one physical system. The post Why reliability metrics must dictate advanced-node physical implementation flow appeared first on EDN .
MACOM Reports Fiscal Fourth Quarter and Fiscal Year 2026 Financial Results - LOWELL, MA, November 5, 2026 – MACOM Technology Solutions Holdings, Inc. (“MACOM”) (Nasdaq: MTSI), a leading supplier of semiconductor products, today announced its financial results for its fiscal fourth quarter and fiscal year ended October 2, 2026.
Democratic rout in U.S. offers opportunity for Korean shipbuilders, uncertainty for chipmakers - Democratic rout in U.S. offers opportunity for Korean shipbuilders, uncertainty for chipmakers The dramatic shift may complicate the calculus for firms investing in the United States, with Trump still in power but facing strong checks by the U.S. Congress. 11/5/2026 - 03:12 AM News Team
Why Power Efficiency Matters in Enterprise NVMe® SSDs - As storage demands grow, power efficiency is becoming just as important as performance. This blog post explores how enterprise NVMe® SSDs can improve energy use, support sustainability goals and help designers maximize rack density in modern data centers.
Naver Cloud ramps up use of AMD EPYC, citing high Intel CPU costs - South Korean cloud services provider Naver Cloud now runs AMD EPYC processors in about 35,000 servers and plans to deploy 144-core fifth-generation EPYC chips in its public cloud services in the second half of 2026. The company turned to AMD after high prices for Intel's higher-core-count processors slowed...
When Agents Are the Interface - Agent economics, who pays for inference, vertical integration, and what it means for Google, Amazon, Microsoft, Meta, OpenAI, Anthropic, Apple and semis
xMEMS Labs Advances Edge AI with Solid-State Cooling and Audio - xMEMS Labs, the pioneer of solid-state MEMS speakers and breakthrough μCooling fan-on-a-chip technology, today announced its CES 2027 demonstrations. The post xMEMS Labs Advances Edge AI with Solid-State Cooling and Audio appeared first on Semiconductor Digest .
CTO Interview with Taylor Barton of Certus Semiconductor - Taylor Barton is a Lead Analog/Mixed-Signal and I/O IC Design Engineer at Certus Semiconductor, where he has worked since December 2022. He has designed more than 20 silicon-proven I/O and ESD libraries and has led analog and I/O IP projects, including ADC and SerDes designs. Taylor holds B.S. and M.S....
Samtec VITA 90 VNX+ for RF backplane, optical, and power connectivity - Mouser Electronics is stocking Samtec’s VITA 90 VNX+, which combines RF backplane, optical, and power connectivity. It is for harsh or space‑constrained applications. The interconnect product family supports small-form-factor, modular, […] The post Samtec VITA 90 VNX+ for RF backplane, optical,...
TUE researchers secure €950K for greener atomic layer etching - The Dutch Research Council (NWO) has awarded approximately 950,000 euros to an Eindhoven University of Technology project investigating more sustainable ways to etch chips with atomic-scale precision.
What’s in the November/December 2026 Issue? - Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue. If you are attending SEMICON Europa, pick up an issue in print at the Tech Arena. The post What’s in the November/December 2026 Issue? appeared first on...
AMD Forecast Exceeds Estimates as AI Chip Demand Soars - Advanced Micro Devices Inc., a key challenger to Nvidia Corp. in artificial intelligence chips, gave a revenue forecast that exceeded analysts’ estimates, showing that demand for data center processors remains strong. Fourth-quarter revenue will be $17 billion, plus or minus 3%, the chipmaker said in...
Randomized Caches in HW: Overheads And Limitations (RUB, Max Planck, Georgia Tech) - Researchers at Ruhr University Bochum, the Max Planck Institute for Security and Privacy, and Georgia Tech published “Randomized Caches in Hardware: Challenges and Trade-offs.” Abstract Excerpt: “Randomized caches protect against side-channel attacks by obfuscating the mapping of memory addresses...
Building connections across the research infrastructure - MIT.nano and the Northeast Microelectronics Coalition gathered facility leaders and technology professionals from across the nation to explore ways to make shared-access facilities more connected.
CTO Interview with Ed Plowman of Imagination Technologies - Ed Plowman is Chief Technology Officer at Imagination Technologies, where he leads technology strategy, advanced architecture research and long-term innovation initiatives. He focuses on the convergence of graphics, compute and artificial intelligence, helping shape the next generation of efficient and...
ElectraIC Avionics IP Cores for FPGA: MIL-STD-1553B, ARINC 429 and ARINC 664 - AnySilicon IP Vendor Spotlight: Avionics communication interfaces demand precise timing, dependable data handling and extensive verification. For FPGA design teams, developing these protocol functions from scratch can add significant integration and validation effort. In this spotlight, Ates Berna, General...
AI Hardware’s Hidden Cost: Between Orders and Output - Alphabet’s TPU inventory, Intel’s manufacturing tradeoffs, and equipment suppliers’ balance sheets show how capital builds up along the path to usable AI computing capacity. The post AI Hardware’s Hidden Cost: Between Orders and Output appeared first on EE Times .
Meta Dominates The Smart Specs Market - Meta’s new Audio AI glasses started selling yesterday after the company’s Gen 3 smart glasses hit markets about three weeks ago. Most notably, the new audio-only model features the usual […] The post Meta Dominates The Smart Specs Market appeared first on Electronics Weekly .
Baidu AI Chip Unit’s Hong Kong IPO Is Said to Slip to Next Year - An initial public offering of Baidu Inc.’s artificial intelligence chip unit may slip to next year, people with knowledge of the matter said, as the company waits for approval from the Chinese securities regulator.
Marvell Snaps Photonics Chipmaker Lumentum to Bolster AI Connectivity - The $115 billion deal aims to create a category leader in AI connectivity by co-designing network processors and lasers for optical transceivers. The post Marvell Snaps Photonics Chipmaker Lumentum to Bolster AI Connectivity appeared first on EE Times .
