Semi. Fabs and Clean Rooms 21h ago: Intel is advancing tool installation at its Arizona Fab 62 and structural work at Ohio One, with 18A yields improving and costs down 40%. Cleanroom space has emerged as the primary bottleneck across the industry, limiting capacity ramps more than tools or demand. Memory makers like SK hynix and Samsung are pacing phased cleanroom openings to match orders, while HBM supply remains constrained by larger die sizes and lengthening tool lead times. Broader themes include China's capacity ambitions and materials expansions supporting advanced fabs.
EU launches €525 million chip design platform to boost startups - Nov-5-2026 — The European Commission has launched the European Chip Design Platform (EuroCDP), backed by €525 million in investment to support a new generation of European semiconductor design companies. The initiative, launched by Henna Virkkunen, Executive Vice-President for Tech Sovereignty,...
RS announces strong half-year results - RS Group has announced strong results for H1 2026 with outperformance in all regions. “We have had a good start to 2026/27,” says RS CEO Simon Pryce. “Manufacturing sentiment remained […] The post RS announces strong half-year results appeared first on Electronics Weekly .
How to Implement "Trust in AI" in Enterprise Environments - What does it take to move AI from proof of concept to trusted use in business? Explore AI trust, data, governance, quality, human oversight, and organizational change through Fujitsu’s implementation experience.
Electrification Week: From Energy to Motion - Explore the technologies shaping intelligent, efficient and integrated electrified systems during Electrification Week, November 16 through 20.
Valens Semiconductor Introduces the VS6310 Chipset - Low-power chipset enables manufacturers to integrate USB3 extension into a variety of conference room peripherals, reducing the need for external extender boxes. The post Valens Semiconductor Introduces the VS6310 Chipset appeared first on Semiconductor Digest .
CTO Interview with Taylor Barton of Certus Semiconductor - Taylor Barton is a Lead Analog/Mixed-Signal and I/O IC Design Engineer at Certus Semiconductor, where he has worked since December 2022. He has designed more than 20 silicon-proven I/O and ESD libraries and has led analog and I/O IP projects, including ADC and SerDes designs. Taylor holds B.S. and M.S....
Samtec VITA 90 VNX+ for RF backplane, optical, and power connectivity - Mouser Electronics is stocking Samtec’s VITA 90 VNX+, which combines RF backplane, optical, and power connectivity. It is for harsh or space‑constrained applications. The interconnect product family supports small-form-factor, modular, […] The post Samtec VITA 90 VNX+ for RF backplane, optical,...
Mission Impossible - Software has been eating the world and now AI is eating software. Rix Groenboom wonders how ICT education programs can still fulfill their role.
What’s in the November/December 2026 Issue? - Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the November/December issue. If you are attending SEMICON Europa, pick up an issue in print at the Tech Arena. The post What’s in the November/December 2026 Issue? appeared first on...
Is There Room for Small-Scale OSATs in India’s Chip Packaging Boom? - Small OSATs in India can start with ₹1.5–₹2 billion (~$15.8–$21 million), consultant Nitin Dodia said. But anchor customers, skilled staff, and qualification determine who survives. The post Is There Room for Small-Scale OSATs in India’s Chip Packaging Boom? appeared first on EE Times .
Generalized Lorentz Framework for Active Semiconductor Quantum Surface Plasmonics - Nanostructured semiconductors provide an actively tunable platform for light-matter interactions across a broad spectral range. As feature sizes shrink to the deep nanoscale (~10 nm scale), nonclassical carrier dynamics and surface plasmonic responses become prominent, creating substantial challenges...
Bosch Establishes Dedicated Semiconductor Division to Strengthen Chip Business - Effective January 1, 2028, Bosch will transfer its semiconductor operations to a new division called Semiconductors. The business will continue to be assigned to the Mobility business sector. Bosch’s semiconductor operations are currently part of its Mobility Electronics division. The post Bosch Establishes...
“Hybrid bonding requires more than a highly accurate machine” - Even silicon starts behaving like rubber on a microscopic level. As hybrid bonding moves toward pitches of 1 micrometer and below, tiny deformations become a major obstacle. Research by Besi and Imec shows why mastering the process is just as important as building a highly accurate bonding machine.
Light Manipulates Magnetic States Faster Than Conventional Methods - Optical control of the magnetism in materials enables magnetic states to be manipulated rapidly, potentially streamlining the storage of digital information. Optical control of magnetization is often symmetry-forbidden, but through a nonlinear response, optical excitation can generate a nonequilibrium...
Baidu AI Chip Unit’s Hong Kong IPO Is Said to Slip to Next Year - An initial public offering of Baidu Inc.’s artificial intelligence chip unit may slip to next year, people with knowledge of the matter said, as the company waits for approval from the Chinese securities regulator.
Marvell Snaps Photonics Chipmaker Lumentum to Bolster AI Connectivity - The $115 billion deal aims to create a category leader in AI connectivity by co-designing network processors and lasers for optical transceivers. The post Marvell Snaps Photonics Chipmaker Lumentum to Bolster AI Connectivity appeared first on EE Times .
TECO deepens robotics push, targets dexterous hands - TECO Electric and Machinery is extending its motor and drive-control expertise into rotary actuators, developing joint modules for humanoid and quadruped robots through in-house motor, drive, and mechanical integration, alongside Taiwan-based reducer suppliers. The company said it has already shipped...
When Agents Are the Interface - Agent economics, who pays for inference, vertical integration, and what it means for Google, Amazon, Microsoft, Meta, OpenAI, Anthropic, Apple and semis
Korea posts record current account surplus - Korea posts record current account surplus The services deficit widened in September as travel spending and intellectual property payments increased, despite strong goods and investment income balances. 11/4/2026 - 07:03 PM
The next scientific breakthrough - Artificial Intelligence The next scientific breakthrough AI and HPC are helping scientists find new value in existing data.
NIST Sets a Clearer Course for the Post-Quantum Security Transition - NIST’s report, Transition to Post-Quantum Cryptography Standards , gives government agencies and technology suppliers a clearer framework for replacing cryptography vulnerable to future quantum computers. Its significance extends beyond selecting algorithms: it connects security priorities, application...
Sustainability Currents: AI’s Physical Bottlenecks Beyond Chips - The AI boom has largely been framed as a race for chips and compute, but as the technology scales, some of its biggest constraints are becoming increasingly physical. On this week’s episode of the Sustainability Currents podcast, Stephen Byrd, global head of thematic and sustainability research at Morgan...
3D-IC Signal Integrity: From Silicon Interposers To System Signoff - A unified, system-level environment that aggregates several proven technologies into a seamless workflow spanning architecture exploration, electromagnetic extraction, channel simulation, protocol compliance verification, and final system-level signoff. The post 3D-IC Signal Integrity: From Silicon Interposers...
Filtronic wins £1.9m DCMS contract - Filtronic has been awarded a £1.9 million contract under the Contracts for Innovation: Advanced Connectivity Technologies (ACT) competition. Delivered by Innovate UK, part of UK Research and Innovation (UKRI), the […] The post Filtronic wins £1.9m DCMS contract appeared first on Electronics Weekly...
CTO Interview with Ed Plowman of Imagination Technologies - Ed Plowman is Chief Technology Officer at Imagination Technologies, where he leads technology strategy, advanced architecture research and long-term innovation initiatives. He focuses on the convergence of graphics, compute and artificial intelligence, helping shape the next generation of efficient and...
ElectraIC Avionics IP Cores for FPGA: MIL-STD-1553B, ARINC 429 and ARINC 664 - AnySilicon IP Vendor Spotlight: Avionics communication interfaces demand precise timing, dependable data handling and extensive verification. For FPGA design teams, developing these protocol functions from scratch can add significant integration and validation effort. In this spotlight, Ates Berna, General...
AI Hardware’s Hidden Cost: Between Orders and Output - Alphabet’s TPU inventory, Intel’s manufacturing tradeoffs, and equipment suppliers’ balance sheets show how capital builds up along the path to usable AI computing capacity. The post AI Hardware’s Hidden Cost: Between Orders and Output appeared first on EE Times .
Meta Dominates The Smart Specs Market - Meta’s new Audio AI glasses started selling yesterday after the company’s Gen 3 smart glasses hit markets about three weeks ago. Most notably, the new audio-only model features the usual […] The post Meta Dominates The Smart Specs Market appeared first on Electronics Weekly .
Why reliability metrics must dictate advanced-node physical implementation flow - Dynamic voltage drops, electromigration, and timing are not three axes to be optimized in sequence; they are one physical system. The post Why reliability metrics must dictate advanced-node physical implementation flow appeared first on EDN .
Infineon and Qualcomm hook up for in-car computing - Infineon and Qualcomm are working together to accelerate the development and deployment of central car computers in software-defined vehicles (SDVs). The companies have signed a technology agreement to have a […] The post Infineon and Qualcomm hook up for in-car computing appeared first on Electronics...
Democratic rout in U.S. offers opportunity for Korean shipbuilders, uncertainty for chipmakers - Democratic rout in U.S. offers opportunity for Korean shipbuilders, uncertainty for chipmakers The dramatic shift may complicate the calculus for firms investing in the United States, with Trump still in power but facing strong checks by the U.S. Congress. 11/5/2026 - 03:12 AM News Team
Why Power Efficiency Matters in Enterprise NVMe® SSDs - As storage demands grow, power efficiency is becoming just as important as performance. This blog post explores how enterprise NVMe® SSDs can improve energy use, support sustainability goals and help designers maximize rack density in modern data centers.
Turning Conv2D Into A Practical GPU Compute Pattern - A reusable optimization mindset for engineers building GPU compute kernels. The post Turning Conv2D Into A Practical GPU Compute Pattern appeared first on Semiconductor Engineering .
Australia’s Surplus Heads for Decade-Low on Chip, Energy Imports - Australia’s trade surplus is on track to slump to its lowest level in a decade this year, as chips and servers needed for data centers add to a surge in imports from China while energy costs spiral higher.
Wi-Fi SoCs pair low power with edge AI - Nordic reports that its nRF71 series of Wi-Fi SoCs delivers up to 20 times lower standby power consumption than the nRF70 series. The post Wi-Fi SoCs pair low power with edge AI appeared first on EDN .
Democratic sweep clouds Korea-U.S. trade deals, boosts clean energy shares - Democratic sweep clouds Korea-U.S. trade deals, boosts clean energy shares A Democratic Congress could intensify scrutiny of Korean investments and nuclear cooperation while lifting hopes for solar and battery companies. 11/4/2026 - 05:12 AM SARAH CHEA, PARK EUN-JEE, KIM MIN-YOUNG
SPIE Names 2027 Prism Award Finalists - SPIE, the international society for optics and photonics, has named its finalists for the 2027 Prism Awards. The 21 products — from plucky startups to industry giants — selected in seven categories, will be honored during a Feb. 3 gala evening at Photonics West in San Francisco. The annual event,...
AMD Forecast Exceeds Estimates as AI Chip Demand Soars - Advanced Micro Devices Inc., a key challenger to Nvidia Corp. in artificial intelligence chips, gave a revenue forecast that exceeded analysts’ estimates, showing that demand for data center processors remains strong. Fourth-quarter revenue will be $17 billion, plus or minus 3%, the chipmaker said in...
Randomized Caches in HW: Overheads And Limitations (RUB, Max Planck, Georgia Tech) - Researchers at Ruhr University Bochum, the Max Planck Institute for Security and Privacy, and Georgia Tech published “Randomized Caches in Hardware: Challenges and Trade-offs.” Abstract Excerpt: “Randomized caches protect against side-channel attacks by obfuscating the mapping of memory addresses...
Building connections across the research infrastructure - MIT.nano and the Northeast Microelectronics Coalition gathered facility leaders and technology professionals from across the nation to explore ways to make shared-access facilities more connected.
IP update from Alphacore at DAC 2026 - Rusafa Shahreen, Director of Technical Marketing at Alphacore met with me at DAC 2026 to provide an update on what’s new in their IP for AMS, RF, imaging and rad-hard designs. Her background includes MSEE and MBA degrees, plus seven years at Alphacore in Arizona. The founders of the company have a rad-hard...
Marvell Acquiring Lumentum for $115B - Marvell has entered into a definitive agreement to acquire Lumentum in an all-stock transaction with an implied enterprise value of $115 billion for Lumentum. Post-closing, Marvell stockholders will own approximately 67% off the combined company on...
Fast, Sub-Volt HZO Ferroelectric Capacitors For DRAM-Like Memory (SNU) - Seoul National University-led researchers published “Resolving the Kay–Dunn limit and the speed–endurance dilemma in ferroelectric Hf0.5Zr0.5O2 for DRAM-class sub-volt capacitors.” The first author, Geun Hyeong Park, Ph.D., summarizes the work here: “Fast, frequently rewritten memory requires...
[News] DeepSeek V5 Could Complete Training on Huawei Ascend 950 in 2027, Moving Beyond Inference - As Huawei accelerates its Ascend AI chip roadmap, with the Ascend 960DT reportedly slated for early 2027, another milestone may be taking shape. According to Caiwen News, citing industry sources, DeepSeek plans to train its next-generation V5 model primarily on Huawei’s Ascend 950 chips, with the ......
Chip Industry Technical Paper Roundup: Nov. 3 - Meter-scale quantum interconnects; 2.5D/3D GPU integration and embodied emissions; secure memory-dependent prefetching; routing-aware analog placement; AI-enhanced flip-chip defect detection; superposed PCM for neural-network vector storage. The post Chip Industry Technical Paper Roundup: Nov. 3 appeared...
Self-driven beta-radiation detection through a graphene/water/silicon heterostructure - …reversible current transients under beta irradiation at zero applied bias. Energetic electrons deposit energy in silicon, producing nonequilibrium carriers that perturb the semiconductor surface potential and electric displacement across the adjacent aqueous interface. The resulting redistribution...
