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45h Western Digital

21h Texas Instrumen…

5¾d Amkor Technolog…

45h Enablence Techn…

 Semi. Fabs and Clean Rooms
35m ago: TSMC Arizona second fab completed construction, volume production 2027. Micron DRAM megafabs breaking ground in NY and ID. Samsung Taylor TX $17B fab resumed. Tata-PSMC Dholera ~$11B fab groundbreaking, 50k wpm at 28-110nm, pilot end-2026. TSMC Kumamoto second fab approved for 3nm. Global 300mm equipment spend $149B (2026) to $227B (2029). Cleanroom lead times 36-48 months for ISO Class 1 High-NA EUV.

 How Singapore Connects Chip Research, Startups, and Manufacturing  - From SiC power devices to silicon photonics, Singapore is building the infrastructure and industrial partnerships needed to bring deep-tech research to market. The post How Singapore Connects Chip Research, Startups, and Manufacturing appeared first on EE Times .

 Recycled Memory Chips Boom in China  - As memory semiconductor prices have soared, a phenomenon of extracting and reselling memory chips from smartphones has emerged in China, according to a recent report by Taiwan TechNews.

 Choo Mi-ae's 'Straw Politics'

 Lightning War Pledge Meets Labor Freeze

 Future Response Fund: Preserve Principal, Use Profits Only

 New York Stock Market Mixed on AI Worries, Rising Oil Prices

 AI spending jitters and oil surge split Wall Street as tech slides

 Bond Yields Are on Fire—and the ‘Bond Vigilantes’ Are Behind It

 ChangXin Memory Technologies Advances Ultra-Fine DRAM for 38% Growth

 Ettifos showcases end-to-end V2X platform at South Korea ITS summit

 Chinese Firms Recycle DRAM Amid Shortage

 China recycles old DRAM to power new budget smartphones amid shortage

 Health Minister Stresses Long-Term National Pension Evaluation

 Jung Eun-kyeong urges long-term assessment as South Korea pension tightens stewardship

 Korea semiconductor meister high school opens 2027 intake as jobs surge

 Ettifos Unveils End-to-End V2X Solutions at Gangneung ITS Congress

 Korean Student Union Members Receive Suspended Sentences for U.S. Base Breach

 Seoul-area housing outlook tops benchmark as prices climb across South Korea

 Wall Street Split on AI Firms' Default Risks, Buying Opportunities

 EST Accelerates Semiconductor Electrostatic Chuck Localization via KOSDAQ Listing

 Kospi drops below 5700 as institutions sell despite US chip rebound

 Bank of Korea to Hold Rates, Signal Further Hikes Amid Inflation

 Autumn IPO Market Bustles with AI, Semiconductor Debuts

 BOS Semiconductors, LG Electronics, Hana Micron Localize Chiplet Vehicle Semiconductors

 Bos Semiconductor , LG Electronics and Hana Micron localize Korea chiplet auto chips

 National Pension Service Boosts Petrochemical, Construction Sectors

 KOSPI Opens Lower Despite U.S. Semiconductor Rebound

 Won-Dollar Exchange Rate Drops 1.3 Won

 Dollar selling by Korea exporters nudges won to 1,329 per dollar

 AMD's FSR 4.1 now works on Radeon RX 6000 cards, Xbox Series X and S, and Ryzen AI Max, AI 9, and Z2 SoCs  - AMD has released a version of its cutting-edge FSR 4.1 upscaler that now works on Radeon RX 6000 GPUs, Xbox Series X and Series S consoles, and Ryzen AI Max, AI 9, and Z2 chips.

 From boon to burden: AI spending woes leave Kospi among worst-performing major indexes  - From boon to burden: AI spending woes leave Kospi among worst-performing major indexes Concerns over AI infrastructure spending are hitting Samsung Electronics and SK hynix, magnifying losses across Korea’s stock market. 10/20/2026 - 06:24 AM JIN MIN-JI, LEE JAE-LIM

 Automotive sensor power supply without a switching pre-regulator  - An automotive sensor power supply appears deceptively simple to design but in fact poses many formidable challenges. The post Automotive sensor power supply without a switching pre-regulator appeared first on EDN .

 Chip Industry Technical Paper Roundup: Oct. 20  - HBM power consumption; GAAFET leakage pathways; agentic AI for heterogeneous system design; nanoelectromechanical gain-cell eDRAM; AI-accelerated 3D-IC thermal modeling; agentic AI for RTL verification and debugging; thermal side-channel attacks in autonomous vehicles. The post Chip Industry Technical...

 SAFE4SOC  - Securing the digital frontier

 Polar Semiconductor Featured on 60 Minutes in Report on Global Helium Shortage  - Polar Semiconductor was recently featured on 60 Minutes as part of a report examining the global helium shortage and why this limited resource matters to industries far beyond its most familiar uses. The 60 Minutes…

 Privacy-Preserving Robust Monitoring of Dense-Time Temporal Logic  - …monitoring. In a number of system testing scenarios, the designer and the tester are separate parties. This testing-as-a-service model is common in software, avionics, and semiconductors , and is growing in importance in the red-teaming of machine learning models. In such a model, the designer seeks...

 Good Golly It’s MOLY  - 65 years ago this ad for TI diodes packaged using its Molybdenum Glass hermetic seal technique appeared in Electronics Weekly’s edition of May 3 1961: The post Good Golly It’s MOLY appeared first on Electronics Weekly .

 HANMI Semiconductor Opens HANMI USA  - HANMI Semiconductor today announced that it has opened U.S. subsidiary HANMI USA, a major step in expanding its presence in the U.S. semiconductor market. The post HANMI Semiconductor Opens HANMI USA appeared first on Semiconductor Digest .

 WFE to the Moon (Still), Semicon West and OCP Insights  - In this action-packed episode of The Circuit, Ben Bajarin and Jay Goldberg recap a hectic week in Silicon Valley, spanning Semicon West in San Francisco, the Open Compute Project (OCP) Summit in San Jose, and major analyst events. The hosts examine the evolving semicap and wafer equipment landscape—including...

 Video Interview: Applied Materials CEO on the Economics Behind Its $5B EPIC Bet  - Following the unveiling of its EPIC Center, Applied Materials revealed strong financial projections. We look at how it all ties together and feature a new video interview with CEO Gary Dickerson. The post Video Interview: Applied Materials CEO on the Economics Behind Its $5B EPIC Bet appeared first on...

 Korea cannot dismiss the despair of French youth  - Korea cannot dismiss the despair of French youth France’s economic strain and anger among the youth at its entrenched system should serve as a clear warning for Korea to diversify growth, create jobs and make housing more affordable. 10/19/2026 - 11:01 AM Opinion Desk

 Starboard Sees Value In Apple Chip Supplier Skyworks  - Starboard Value, which just acquired a stake in Skyworks Solutions Inc. via its takeover of Qorvo Inc., sees big upside should it execute on the goals of its merger with the rival wireless chipmaker, according to people familiar with the matter.

 Accelerate Motor Control and Embedded Development With Microchip  - Microchip rounds out its newest release wave with tools built for engineers developing and debugging embedded systems—from a dual-core motor control daughter card to an OpenOCD debug probe, a new Curiosity Nano and a functional safety development kit.

 Researchers Unleash Record-Breaking X-Ray Flashes in Just 300 Attoseconds  - Researchers used the European XFEL to produce ultrashort X-ray flashes that reached record intensity for this type of pulse. To understand chemical reactions and perhaps one day control the electrons involved, scientists need a detailed picture of how electrons behave inside atoms and molecules. X-rays...

 AI 算力引爆架構革命,光互連、800VDC 與硬體安全三大關鍵台系供應鏈受惠  - 隨著人工智慧(AI)算力需求呈現爆炸式成長, 前開放運算計畫(OCP)全球峰會正式登場。對此,外資摩根士丹利(Morgan Stanley;大摩)出具最新產業研究報告指出,本次峰會涵蓋三大核心技術變革,包括光互連傳輸架構躍升、800VDC...

 [News] NVIDIA Reportedly Pushes TSMC 3nm NVHBM Base Dies for Samsung, SK hynix, Micron, Uniting Foundry Rivals  - As previously reported by ZDNet in September, Samsung is pursuing a dual-track strategy for custom HBM, tapping both its own foundry and rival TSMC for base die production. A new report from Seoul Economic Daily lends further weight to this strategy, revealing that NVIDIA has asked Samsung, SK hynix......

 Thermal Side Channels Create New Security Risks For Autonomous Vehicles (Missouri S&T)  - Researchers at Missouri University of Science and Technology published “Can Autonomous Vehicles Keep Their Cool? A Survey of Thermal Side-Channel and Perception Attacks.” Abstract excerpt: “This survey systematizes thirteen representative works into thermal perception integrity, telemetry leakage,...

 Korean won climbs to two-year high as chip exports boost dollar supply  - Korean won climbs to two-year high as chip exports boost dollar supply The won strengthened against the dollar as robust exports and a widening trade surplus increased market dollar supply, though geopolitical and oil-price risks remain. 10/18/2026 - 01:00 AM

 ☀️ 🇦🇺 AsiaPac 
🇰🇷  ---  ☀️ +

6d SK Hynix

↺6d Taiwan Semicond…3.2% beat 🟢

 Tens of thousands of Nvidia GPUs sit idle in Meta's Prometheus supercluster, just waiting for a failure  - And other fun facts about how Zuckercorp aims to keep a million GPUs running long enough to train a model

 Single transistor design combines memory and signal processing for brain-inspired computing  - As artificial intelligence moves increasingly toward edge devices, researchers are exploring electronic components that can combine memory and information processing. Memristive and synaptic devices are of particular interest ...

 AI infrastructure faces four hurdles: Power, construction, technology, funding  - At last week's SEMICON West 2026 industry outlook forum, research firms said investment in US AI data centers continues to accelerate, but the industry still faces multiple hurdles before it can turn demand into operational computing capacity. Constraints now extend beyond chips to power and the grid,...

 Innodisk’s DDR5 8000 RDIMM addresses edge AI  - Innodisk is expanding its DDR5 portfolio with 8000 RDIMM for compute-intensive applications, such as edge AI and enterprise servers. As the name indicates, the modules deliver data transfer speeds of […] The post Innodisk’s DDR5 8000 RDIMM addresses edge AI appeared first on Electronics Weekly .

 Perché proprio il carburo di silicio (SiC)?  - La specifica di Google, Microsoft e NVIDIA non impone nessuna tecnologia. Ma tre formule spiegano perché, oggi, i suoi numeri portano al SiC.

 Powertip Technology transitions into a solutions provider as demand and costs rise  - Powertip Technology is transitioning from a module design and supply company to a solutions provider. The company has seen rising demand in the first half of 2026 as the electronics and manufacturing industries faced higher material costs, which it aims to control by negotiating price adjustments with...

 Daeduck Electronics targets 2029 ceramic substrates for AI packaging

 Genius Electronic Optical partners with 3M on EBO development

 Hygon's revenue jumps 58% on AI chip demand, but growth slows amid 51% stock slump

 Samsung's HBM4 supply lock-in exposes limits of China's CXMT as Apple and Tesla seek DRAM alternatives

 AI servers drive TVS and ESD demand for Yea Shin Tech

 Thermaltake expands AI workstation lineup on edge AI demand

 AUO selects glass substrate specs for semiconductor processes, not size rivalry

 Taiwan anchors US chip revival, SEMICON West spotlights trusted partners

 AI server demand lifts Tongtai drilling orders through 2027

 US firms eye Malaysia to diversify rare earth supply chains

 Chief Telecom starts NT$3.3 billion AI data center in Taiwan

 Wistron Medical Technology and Chang Gung University expand AI elder-care training

 Intel requests FCC waiver from US foreign robot ban, citing impact on US chipmaking

 Jensen Huang urges Germany to embrace physical AI at Berlin summit

 Unimicron chairman sees substrate sizes reaching 14x current scale by 2030

 TPK targets 2028 TGV mass production with NT$6 billion investment

 China's tech-driven commerce plan pushes AI into phones, PCs, and robots

 Amkor triples Gwangju investment as AI packaging demand grows

 TiMotion targets robot market as Vietnam plant is set to open by year-end

 Apple sets October 28 event, eyes first touchscreen MacBook Pro

 IFA CEO: Taiwan tech to leverage core silicon strengths to counter China's momentum

 Malaysia says data center investors must fund transmission upgrades

 Exclusive: Apple's MacBook Neo pressures Microsoft to cut specs for low-cost 12-inch Surface

 Intel says it is the only high-volume fab for 12-inch InP silicon photonics as co-packaged optics nears deployment

 China's S2C–HyperSilicon merger targets hardware emulation gap in domestic EDA with Empyrean backing

 AI substrate bottleneck shifts from design to manufacturing

 Nscale set to lose Microsoft as anchor tenant over UK power delays, adding uncertainty to IPO

 Kioxia targets higher-value AI storage with Nvidia partnership, advanced NAND technology

 Nvidia says South Korea has Vera CPU customers, LG robot results ahead

 DeepSeek-Huawei chip co-design could shift AI training away from Nvidia

 US orders DeepSeek removed from federal civilian IT systems

 Tech giants race to train FDE talent as AI deployment gains urgency

 ChatGPT hits 60,000 advertisers as OpenAI cuts prices

 Commentary: Samsung's US 2nm ramp faces no room for error

 Yale develops fluidic memory chip using water flow, microfibers

 Sandisk to be exclusive storage provider for Meta VR Glasses

 Foxconn's FoxBrain 2.0 sets sights on physical AI with VLM, VLA ambitions

 South Korean govt, SK Hynix launch KRW2 trillion loan guarantee program for chip suppliers

 Alibaba's XuanTie tops 6 billion RISC-V chip shipments, expands into AI servers with C950

 MediaTek's Google TPU v9 faces potential delay over glass substrate yields, but 2026 orders remain strong

 Analysis: China's proposed AI export controls target top-ranked foundation models, advanced agents

 Google demonstrates magic state cultivation on Willow, cutting errors by about 40-fold

 Nvidia seeks Taiwan government affairs director amid deeper local push

 Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure

 Zhen Ding launches PCB talent development platform with National Central University, partners

 Hanmi Semiconductor establishes US hub to support AI packaging customers

 Alibaba’s RISC-V IP powers over 6 billion shipped chips as tech giant targets AI, autos  - The milestone comes as Chinese chipmakers seek to reduce dependence on foreign tech amid US-led export restrictions

 DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die  - Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt (kW) scale. Heat sink specialist Jentech Precision points out that package lids are evolving beyond conventional solid-state...

 OpenAI's Altman teases humanoid demo in 2027  - The company is moving from robot hand dexterity to how the humanoid brain relies on AI models

 Meta and Google Rejoin the Frontier, Microsoft’s Maia 300, and the AI Credit Scare | The Six Five Pod Ep. 324  - On Episode 324 of The Six Five Pod, Patrick Moorhead and Daniel Newman unpack the biggest stories from the week, including new agent models from Meta, Google, and NVIDIA, Microsoft's Maia 300, Applied Materials' EPIC Center, AMD, NVIDIA, and Cisco at OCP Global Summit 2026, and the Apple-Meta Muse Spark...

 Won for the win  - Won for the win A currency exchange shop in the Myeongdong neighborhood of Jung District, central Seoul, is displaying exchange rates on Oct. 19. 10/19/2026 - 04:34 AM

 Chip Startup Tenstorrent Raises Funds at $6.2 Billion Value  - AI chip startup Tenstorrent Inc., after attracting takeover interest earlier this year, has raised $1.5 billion from investors in a funding round that boosts its valuation to $6.2 billion.

 Trapped Ion Computing Company Universal Quantum Raises $100M  - Universal Quantum, a quantum computing company, raised over $100 million in Series A funding in a funding round co-led by DCVC and Firgun Ventures.

 Special Report: Comparison of MediaTek's FR2 IF Tranceivers  - The report is written for RF architects, competitive analysts, and product planners who need to understand how a leading mmWave transceiver supplier changes its design from one generation to the next. The analysis first lays out the three devices side by side across the package, die, and architecture...

 The Workforce Behind the Roadmap  - For three years, every semiconductor conference has featured some version of the same slide: the industry doesn’t have enough people to build what it’s promising. This month, SEMI’s National Network for Microelectronics Education (NNME), backed by the National Science Foundation and the U.S. Department...

 Why Physical AI Is So Hard To Engineer  - Integrating sensors, compute, and actuators into autonomous systems adds new challenges for chip design. The post Why Physical AI Is So Hard To Engineer appeared first on Semiconductor Engineering .

 [News] NVIDIA Chooses Monolithic Die Over Chiplets for Vera CPU, Claims 2× x86 Performance in Agentic AI  - The rise of agentic AI is reshaping CPU design priorities. According to Wccftech, which interviewed NVIDIA's Vera team, the company has chosen a monolithic compute die for its Vera CPU over the chiplet architectures used by major x86 competitors. Vera also features a custom LPDDR5X memory subsystem ......

 OCP Global Summit 2026: Irrational Recap  - NPO, Slow-and-Wide, Analog (Semtech Analyst Day), Bubble Vibes

 Datacenters 2027: The Year of Acceleration, +50GW in a Single Year  - 60GW Under Construction, SemiAnalysis Leading Indicators, 1.3T of Lease Contracts Signed YTD, The Shortage Could Move to Chips

 Fiber optic gyroscopes: Elegant engineering of modern inertial navigation  - Fiber optic gyroscope (FOG), a marvel of solid-state engineering, bridges Einstein’s relativity with modern tactical guidance. The post Fiber optic gyroscopes: Elegant engineering of modern inertial navigation appeared first on EDN .

 AI boom to sustain Korea amid global headwinds for years, says senior IMF official  - AI boom to sustain Korea amid global headwinds for years, says senior IMF official The IMF raised Korea’s 2026 growth forecast to 3.3 percent as AI-driven semiconductor exports offset global economic risks. 10/18/2026 - 12:20 AM

 La Cina scala il packaging  - Utili in forte crescita, fabbriche nuove, debito a tassi agevolati e ora anche nuovo capitale.

 Maskless EUV Lithography: An Alternative to E-Beam  - Semiconductor manufacturing depends on lithography: the process of transferring tiny circuit patterns onto a silicon wafer. Conventional extreme-ultraviolet (EUV) lithography projects light with a wavelength of 13.5 nanometers through a reflective optical system, using a custom photomask to define each...

 🌑 🇨🇭🇫🇷🇮🇱 EMEA 
🇩🇪  ---  ☀️ +

7d NXP Semiconduct…

 Micron Invests in New York Critical Minerals Processing With Indium Corporation  - Latest investment under Micron's up to $3 billion U.S. supply-chain plan strengthens the domestic semiconductor ecosystem and expands access to critical materials for advanced memory manufacturing. The post Micron Invests in New York Critical Minerals Processing With Indium Corporation appeared first...

 The Industry Challenge: AI Is Forcing Semiconductor Innovation Beyond the Chip  - Applied Materials President and CEO Gary Dickerson with the EPIC Center founding partners on October 12, 2026, in Sunnyvale, CA. (Tomas Ovalle/AP Content Services for Applied Materials, Inc.) The bottlenecks are becoming interconnected

 Learn STM32 Programming with MicroPython or Arduino  - Blinking an LED might not sound particularly exciting, but it’s often where the fun begins. Once you…

 Too old, but not old enough: Koreans in their 40s face job market squeeze, support blind spot  - Too old, but not old enough: Koreans in their 40s face job market squeeze, support blind spot Employment losses, early retirements and limited support programs are leaving midlife workers caught between youth and senior job policies. 10/19/2026 - 10:27 PM News Team

 Community Colleges Put New Workers Into Semiconductor Jobs Fast  - TSMC, Intel, and others need the colleges to train technicians

 Everspin Technologies to Chair New JEDEC® Task Group Exploring LPDDR Persistent Memory Standard  - New effort brings together industry stakeholders to address controller support and interoperability for persistent memory within LPDDR architectures CHANDLER, Ariz.--(BUSINESS WIRE)--Oct…

 輝達以歐洲最大超級電腦完成 104 量子位元容錯模擬,股價因「破紀錄」上漲  - 輝達(NVIDIA)19 在柏林 GTC 大會 宣布 ,利用德國尤利希超級電腦中心(Jülich Supercomputing Centre)的 JUPITER 超級電腦,完成 104 量子位元的容錯量子運算模擬。輝達表示,這是目前規模最大、細節最完整的容錯量子處理器模擬,過去從未有模擬如此精細重現量子處理器運作。...

 Building Physical AI Systems That Can Work in the Real World  - Build scalable physical AI by balancing compute, power, safety, and cost—see why system architecture outperforms raw model size. The post Building Physical AI Systems That Can Work in the Real World appeared first on EE Times .

 Bloomberg Daybreak Asia: Asia Bucks US Chip Rally  - Business and finance news from the Asia-Pacific.Asian stocks dropped, diverging from a chip-led rally on Wall Street, as sentiment toward the artificial intelligence trade remained jittery ahead of key earnings this week that will test the strength of gains in the technology sector. The MSCI Asia Pacific...

 Korea’s $1 Trillion Chip Bet to Revive Left-Behind Region Risks Trump’s Ire  - A new semiconductor hub may help spread AI wealth to the country’s southwest, but could also become another point of friction in Seoul’s relationship with Washington.

 記憶體雜音多 法人:Q4 NAND漲價三成  - 記憶體族群近期面臨陸系業者技術追趕、HBM規格調整及AI資本支出能否延續等疑慮,股價承壓。不過,法人指出,記憶體報價維持上行,預估第四季NAND價格季增30%、DRAM合約價季增約20%,AI推論需求擴張與成熟製程新增供給受限,支撐產業長期展望。...

 Nvidia Vera’s System Architecture: Pushing Bandwidth ...  - Nvidia’s Vera server chip aims for high per-core performance. ...

 Korea growth may top IMF forecast  - Korea growth may top IMF forecast Finance Minister Lee Hyoung-il said strong exports and investment could lift growth above the IMF's 3.3 percent projection. 10/18/2026 - 11:04 PM

 Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)  - Researchers at Argonne National Laboratory and the University of Illinois Urbana-Champaign published a technical paper titled “Agentic AI for Heterogeneous System Design Across Chip, Scale-Up, and Scale-Out Domains.” Abstract Excerpt: “The design space of modern AI/HPC systems has expanded rapidly...

 Spectrum Instrumentation digitisers get onboard averaging function  - Spectrum Instrumentation has introduced a new firmware option for its high-resolution 59xx series digitizers to perform onboard summation averaging. The tool is for reducing unwanted signal noise while and improving […] The post Spectrum Instrumentation digitisers get onboard averaging function appeared...

 Scientists Turn Ordinary Plastic Into Billions of Tiny Diamonds Using Powerful Lasers  - Diamonds recovered from plastic contain roughly 3,000 atoms each and could be modified with other elements for future use in medical imaging. Powerful lasers can turn plastic into tiny diamonds, but recovering the crystals means catching them as they shoot out at speeds comparable to a meteorite impact....

 Optical Fiber Spot Prices Surge Severalfold in 2026, with Data Center-Driven Supply Shortages Expected to Persist Through 2028, Says TrendForce  - AI data centers, data center interconnects, and high-capacity backbone network deployments are driving rising demand for optical fiber. According to TrendForce’s latest telecommunications industry research, this is expected to lead to a global supply shortfall of 180 million fiber-kilometers in 2026....

 Who Wants A Sports Car?  - Tesla unveiled its flying Roadster last week, marking a return to the company’s roots. The very first vehicle Tesla ever sold was an electric sports car. The new Roadster is […] The post Who Wants A Sports Car? appeared first on Electronics Weekly .

 SFP: The multimode module autopsy  - A dissimilar laser technology trades off range for cost, at least theoretically. But it’s still faster than the LED-based predecessor. The post SFP: The multimode module autopsy appeared first on EDN .

 Multidimensional Microscope Reveals Ultrafast Changes in Materials  - To understand the microscopic processes underlying quantum and optoelectronic materials, it is necessary to observe how the materials evolve in across space and time. Existing techniques cannot simultaneously resolve ultrafast coherent dynamics with microscopic spatial information. Pump-probe microscopy...

 From Macro to Micro, and Back  - This year’s Nobel prizes explained large systems through their smallest parts. What can chip design learn from them, and can AI help us design in the other direction too? The post From Macro to Micro, and Back appeared first on EE Times .

 Samsung, Micron, Hynix to use TSMC base dies for NVHBM  - Nvidia has asked Samsung. Hynix and Micron to use base dies made on TSMC’s 3nm node for its custom HBM called NVHBM (pictured), reports the Seoul Economic Daily. The base dies […] The post Samsung, Micron, Hynix to use TSMC base dies for NVHBM appeared first on Electronics Weekly .

 Foundryecosystem Report: AI CapEx, AI fabs, TSMC, Intel  - There are also new foundry developments in GaN, SiC, quantum computing and MEMS

 Scientists Discover Metals That Refuse To Crack at an Astonishing -424°F  - Two experimental alloys resisted cracking at −424°F by forming new crystal defects, offering a possible route to tougher metals for extreme cold. Most metals become stronger as they cool, but some also become more vulnerable to breaking. Iron, tungsten, and chromium belong to a class called body-centered...

 Spending looks different when you're in charge  - Spending looks different when you're in charge A record budget and temporary tax windfall should prompt debt reduction and stronger oversight before new spending becomes permanent. 10/18/2026 - 11:01 AM Opinion Desk

 NVIDIA and Cisco Introduce New Pluggable Optics Form Factor to Scale AI Factories  - Original Article By SemiVision Research [Reading time: 15 mins]